Electron Cyclotron Resonance Plasma Deposition Technique Using Raw Material Supply by Sputtering
- 1 August 1984
- journal article
- Published by IOP Publishing in Japanese Journal of Applied Physics
- Vol. 23 (8A) , L534
- https://doi.org/10.1143/jjap.23.l534
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Low Temperature Chemical Vapor Deposition Method Utilizing an Electron Cyclotron Resonance PlasmaJapanese Journal of Applied Physics, 1983
- Correlation of sputtering conditions with electronic conduction in Ta2O5 filmsJournal of Vacuum Science and Technology, 1977
- Electric fields parallel to the magnetic field in a laboratory plasma in a magnetic mirror fieldJournal of Plasma Physics, 1974
- Core electron binding energies in some Group IIIA, VB, and VIB compoundsInorganic Chemistry, 1973