Electrical isolation process for molded, high-aspect-ratio polysilicon microstructures
- 7 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Embedded interconnect and electrical isolation for high-aspect-ratio, SOI inertial instrumentsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Hexsil tweezers for teleoperated micro-assemblyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002