Embedded interconnect and electrical isolation for high-aspect-ratio, SOI inertial instruments
- 22 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 1, 637-640
- https://doi.org/10.1109/sensor.1997.613732
Abstract
No abstract availableThis publication has 6 references indexed in Scilit:
- A CMOS Dissolved Wafer Process For Integrated P++ Microelectromechanical SystemsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- Integrating SCREAM micromachined devices with integrated circuitsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Batch transfer of microstructures using flip-chip solder bump bondingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- A 3-axis surface micromachined ΣΔ accelerometerPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- A merged MEMS-CMOS process using silicon wafer bondingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- A surface micromachined silicon accelerometer with on-chip detection circuitrySensors and Actuators A: Physical, 1994