A merged MEMS-CMOS process using silicon wafer bonding
- 19 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 613-616
- https://doi.org/10.1109/iedm.1995.499296
Abstract
No abstract availableKeywords
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- A novel structure of pressure sensorsIEEE Transactions on Electron Devices, 1991