Coplanar bond wire interconnections for millimeter-wave applications
- 19 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 178-180
- https://doi.org/10.1109/epep.1995.524887
Abstract
An investigation of bond wire interconnections for coplanar integrated millimeter-wave circuits is presented. Assuming a transmission line behaviour of the bond wire its characteristic impedance and propagation constant are calculated using two dimensional finite element simulations. The model is validated by comparison with experimental data and then used to estimate the maximum length for bond wires in millimeter-wave applications. Bond wire matching networks are introduced giving a broadband improvement in the behaviour of interconnections with long wires.Keywords
This publication has 3 references indexed in Scilit:
- Wideband characterization of a typical bonding wire for microwave and millimeter-wave integrated circuitsIEEE Transactions on Microwave Theory and Techniques, 1995
- Characteristic Impedance of Integrated Circuit Bond Wires (Short Paper)IEEE Transactions on Microwave Theory and Techniques, 1986
- Propagating Modes Along a Thin Wire Located Above a Grounded Dielectric SlabIEEE Transactions on Microwave Theory and Techniques, 1977