Wideband characterization of a typical bonding wire for microwave and millimeter-wave integrated circuits
- 1 January 1995
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Microwave Theory and Techniques
- Vol. 43 (1) , 63-68
- https://doi.org/10.1109/22.363006
Abstract
No abstract availableThis publication has 11 references indexed in Scilit:
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