Fluxless no-clean assembly of solder bumped flip chips
- 23 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 552-558
- https://doi.org/10.1109/ectc.1996.517442
Abstract
No abstract availableKeywords
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- Flip chip process development techniques using a modified laboratory aligner bonderPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Smart MEMS: flip chip integration of MEMS and electronicsPublished by SPIE-Intl Soc Optical Eng ,1995
- Application of ESEM to fluxless solderingMicroscopy Research and Technique, 1993