Solder Joint Behavior in HCC/PWB Interconnections
- 1 September 1985
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 8 (3) , 391-396
- https://doi.org/10.1109/tchmt.1985.1136512
Abstract
No abstract availableThis publication has 1 reference indexed in Scilit:
- High Pinout IC Packaging and the Density Advantage of Surface MountingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983