The effect of subtractive defects and grain size on VLSI interconnect early failure
- 1 November 1992
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 220 (1-2) , 24-29
- https://doi.org/10.1016/0040-6090(92)90543-k
Abstract
No abstract availableThis publication has 7 references indexed in Scilit:
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