The Effect of the Passivation Material on the Stress and Stress Relaxation Behavior of Narrow Al-Si-Cu Lines
- 1 January 1996
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Measurement and interpretation of strain relaxation in passivated Al–0.5% Cu linesJournal of Materials Research, 1996
- Analysis of stresses in passivated metal linesAIP Conference Proceedings, 1996
- Stress Relaxation in Al-Si-Cu Thin Films and LinesMRS Proceedings, 1994
- Stress-induced void formation in metallization for integrated circuitsMaterials Science and Engineering: R: Reports, 1993
- Thermal stresses in aluminum lines bounded to substratesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992
- A study of stress-driven diffusive growth of voids in encapsulated interconnect linesJournal of Materials Research, 1992