Demonstration of 125-Gbps optical interconnects integrated with lasers, optical splitters, optical modulators and photodetectors on a single silicon substrate
- 29 November 2012
- journal article
- research article
- Published by Optica Publishing Group in Optics Express
- Vol. 20 (26) , B256-B263
- https://doi.org/10.1364/oe.20.00b256
Abstract
Silicon optical interposers for inter-chip interconnects, integrated with an arrayed laser diode, an optical splitter, silicon optical modulators and germanium photodetectors on a single silicon substrate were demonstrated. A 12.5-Gbps error-free data transmission and 6.6-Tbps/cm2 transmission density were achieved.Keywords
This publication has 8 references indexed in Scilit:
- 2-pJ/bit (On-Chip) 10-Gb/s Digital CMOS Silicon Photonic LinkIEEE Photonics Technology Letters, 2012
- 125-Gb/s operation with 029-V·cm V_πL using silicon Mach-Zehnder modulator based-on forward-biased pin diodeOptics Express, 2012
- Low-voltage high-performance silicon photonic devices and photonic integrated circuits operating up to 30 Gb/s.Optics Express, 2011
- First demonstration of high density optical interconnects integrated with lasers, optical modulators, and photodetectors on single silicon substrateOptics Express, 2011
- Optical technology for energy efficient I/O in high performance computingIEEE Communications Magazine, 2010
- Compact and Low Power Consumption Hybrid Integrated Wavelength Tunable Laser Module Using Silicon Waveguide ResonatorsJournal of Lightwave Technology, 2010
- Integrated GHz silicon photonic interconnect with micrometer-scale modulators and detectorsOptics Express, 2009