Simulation of electromigration behaviour in Al metallization of integrated circuits
- 1 January 1992
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 32 (1-2) , 21-24
- https://doi.org/10.1016/0026-2714(92)90083-w
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Electromigration, Stresses, and Pulse Effects in Thin-Film Conductors ModelPhysica Status Solidi (a), 1990
- A model for electromigration behaviour in terms of flux divergencesScripta Metallurgica, 1987