A quarter-micron interconnection technology using Al-Si-Cu/TiN alternated layers
- 9 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 281-284
- https://doi.org/10.1109/iedm.1991.235448
Abstract
No abstract availableThis publication has 6 references indexed in Scilit:
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