Efficient p-type doping of 6H-SiC: Flash-lamp annealing after aluminum implantation

Abstract
Flash-lamp annealing was used for activation and crystal recovery of highly aluminum-implanted 6H-SiC wafers. In comparison with conventional furnaceannealing, the free hole concentration can be remarkably increased at high acceptor atom concentrations (⩾5×10 20 cm −3 ). The lowest resistivitymeasured at room temperature was 0.01 Ω cm. In this case, the layers are characterized by metallic conduction with weak dependence of the hole concentration on the temperature. This effect is caused by freezing-in of the enhanced solubility of aluminum in SiC at the extraordinary high temperature of about 2000 ° C during the light-flash.

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