Co-Deposition of Sulphur from Acid Copper Solution Containing Thiourea
- 1 January 1966
- journal article
- Published by Taylor & Francis in Transactions of the IMF
- Vol. 44 (1) , 152-160
- https://doi.org/10.1080/00202967.1966.11870001
Abstract
No abstract availableThis publication has 7 references indexed in Scilit:
- On the mechanism of levelling by addition agents in electrodeposition of metalsElectrochimica Acta, 1965
- Verhalten des Thioharnstoffs bei der Kupfer‐Abscheidung aus sauren Kupfersulfat‐BädernChemie Ingenieur Technik - CIT, 1964
- A Study of Levelling in Nickel and Copper Plating SolutionsTransactions of the IMF, 1964
- Radiotracer Study of Addition Agent Behaviour: 1—Incorporation of Sulphur and Carbon in Nickel Deposited from Solutions Containing ThioureaTransactions of the IMF, 1962
- A Radioisotopic Study of Leveling in Bright Nickel Electroplating BathsJournal of the Electrochemical Society, 1959
- An Investigation of the Mechanism of Levelling in ElectrodepositionTransactions of the IMF, 1956
- Polarography of Copper Complexes. II. Dipyridyl, Orthophenanthroline and Thiourea Complexes. A Double Complex System1Journal of the American Chemical Society, 1950