On the validity of the resistometric technique in electromigration studies of narrow stripes

This publication has 5 references indexed in Scilit:

• A comparison of the median time to failure with temperature-ramp resistance analysis to characterize electromigration to determine electromigration kinetic parameters
  Thin Solid Films, 1987
• Electromigration in sputtered Al-Cu thin films
  Thin Solid Films, 1983
• Temperature-ramp resistance analysis to characterize electromigration
  Solid-State Electronics, 1983
• A model for the width dependence of electromigration lifetimes in aluminum thin-film stripes
  Applied Physics Letters, 1980
• Electromigration—A brief survey and some recent results
  IEEE Transactions on Electron Devices, 1969