Nondestructive Multilevel Interconnect Parameter Characterization For High-performance Manufacturable VLSI Technologies
- 1 January 1993
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Parameterized SPICE subcircuits for submicron multilevel interconnect modelingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- A manufacturable 2.0 micron pitch three-level-metal interconnect process for high performance 0.8 micron CMOS technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1990