Design-of-experiment methods for computational parametric studies in electronic packaging
- 1 July 1998
- journal article
- Published by Elsevier in Finite Elements in Analysis and Design
- Vol. 30 (1-2) , 125-146
- https://doi.org/10.1016/s0168-874x(98)00033-x
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Simulation of the Influence of Manufacturing Quality on Reliability of ViasJournal of Electronic Packaging, 1995
- Modeling Solder Joint Fatigue Life for Gullwing Leaded Packages: Part I—Elastic Plastic Stress ModelJournal of Electronic Packaging, 1995
- Use of Half-Normal Plots in Interpreting Factorial Two-Level ExperimentsTechnometrics, 1959