Effect of plasma poly etch on effective channel length and hot carrier reliability in submicron transistors
- 1 April 1994
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Electron Device Letters
- Vol. 15 (4) , 140-141
- https://doi.org/10.1109/55.285403
Abstract
The effective channel length (L/sub eff/)) variation resulting from exposure to the plasma during the poly-etch step was investigated. The plasma induced charging effect was also studied using gate polysilicon antenna structures. It was found that, due to the poly etching, the L/sub eff/ variation has a larger impact on the fully processed transistor transconductance characteristics than the charging effect in the gate oxide region. It is believed that the damage in the LDD region, which gives rise to the L/sub eff/ variation, imposes a serious hot carrier reliability problem.Keywords
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