Effect of temperature on isothermal fatigue of solders
- 1 January 1990
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 13 (4) , 909-913
- https://doi.org/10.1109/33.62555
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Isothermal fatigue of low tin lead based solderMetallurgical Transactions A, 1988
- Low-Frequency, High-Temperature Low Cycle Fatigue of 60Sn-40Pb SolderPublished by ASTM International ,1988
- Solder Fatigue Problems in Power PackagesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
- Fatigue: A complex subject—Some simple approximationsExperimental Mechanics, 1965