Surfactant-Catalyzed Chemical Vapor Deposition of Copper Thin Films
- 6 July 2000
- journal article
- research article
- Published by American Chemical Society (ACS) in Chemistry of Materials
- Vol. 12 (8) , 2076-2081
- https://doi.org/10.1021/cm990805+
Abstract
No abstract availableKeywords
This publication has 26 references indexed in Scilit:
- Atomistic Mechanism of Surfactant-Assisted Epitaxial GrowthPhysical Review Letters, 1998
- Chemical Vapor Deposition of Copper from (hfac)CuL (L = VTMS and 2-Butyne) in the Presence of Water, Methanol, and Dimethyl EtherChemistry of Materials, 1996
- The Processing Windows for Selective Copper Chemical Vapor Deposition from Cu(hexafluoroacetylacetonate)trimethylvinylsilaneJournal of the Electrochemical Society, 1995
- Surfactant-Induced Layer-by-Layer Growth of Ag on Ag(111): Origins and Side EffectsPhysical Review Letters, 1994
- Layer-by-layer growth of Ag on Ag(111) induced by enhanced nucleation: A model study for surfactant-mediated growthPhysical Review Letters, 1993
- Selectivity and Copper Chemical Vapor DepositionJournal of the Electrochemical Society, 1992
- Carbon-halogen bond dissociation on copper surfaces: effect of alkyl chain lengthThe Journal of Physical Chemistry, 1992
- Chemical vapor deposition of copper from (hexafluoroacetylacetonato)(alkyne)copper(I) complexes via disproportionationChemistry of Materials, 1991
- Electrochemistry at well-characterized surfacesChemical Reviews, 1988
- Electrodeposition of Copper on Platinum (111) Surfaces Pretreated with Iodine: Studies by LEED, Auger Spectroscopy, and ElectrochemistryJournal of the Electrochemical Society, 1984