Inter-diffusion phenomena and electrical conduction in thick-film segmented-resistor structures
- 14 December 1988
- journal article
- Published by IOP Publishing in Journal of Physics D: Applied Physics
- Vol. 21 (12) , 1796-1801
- https://doi.org/10.1088/0022-3727/21/12/022
Abstract
Inter-facial processes and charge-transport mechanisms in a segmented resistor have been investigated using single- and double-layer resistive test structures. Microstructure studies of the cross section of the specimens supported by elemental mapping using energy- and wavelength-dispersive X-ray analysis show that, in dual-layer structures, RuO2 agglomerates in a thin region near the interface and the current flow takes place principally through this region. From the Arrhenius plots of the specimens combined with Mott's T1/4 law, it is found that the conduction mechanism at the junction of two cofired thick resistive films is governed by the mechanism of the lower-sheet-resistivity film.Keywords
This publication has 8 references indexed in Scilit:
- On the TCR and Electrical Conduction in a Thick-Film Segmented-Resistor StructurePhysica Status Solidi (a), 1987
- Development of a thick-film tunable RC-active filter using segmented resistorsInternational Journal of Electronics, 1987
- Interactions between thick resistive films and design criteria for segmented resistorsJournal of Physics D: Applied Physics, 1987
- The Microstructure of RuO2Thick Film Resistors and the Influence of Glass Particle Size on their Electrical PropertiesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
- Investigation of parameter sensitivity of short channel mosfetsSolid-State Electronics, 1982
- Simple method for estimating energy levels of solidsJournal of Vacuum Science and Technology, 1979
- Conduction in non-crystalline materialsPhilosophical Magazine, 1969
- Conduction in glasses containing transition metal ionsJournal of Non-Crystalline Solids, 1968