Capacitance coefficients for VLSI multilevel metallization lines
- 1 March 1987
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electron Devices
- Vol. 34 (3) , 644-649
- https://doi.org/10.1109/t-ed.1987.22975
Abstract
The problem of reducing the complexity of parasitic capacitance evaluation of interconnection lines in a multilevel stratified dielectric medium (a good approximation for VLSI) is considered. We start out with a review of the Green's function method for the Si-SiO2composite and its derivation via the Fourier integral approach. Next, a piecewise linear finite-element technique is proposed to solve the integral equations that relate charges to potentials and lead to the desired capacitance matrix. We show by example that the proposed method is both less complex than methods based on piecewise constant surface charge distributions and equally accurate. This supports the accuracy and usefulness of the technique for IC design.Keywords
This publication has 16 references indexed in Scilit:
- On the parasitic capacitances of multilevel parallel metallization linesIEEE Transactions on Electron Devices, 1985
- EXCL: A Circuit Extractor for IC DesignsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1984
- Simple formulas for two- and three-dimensional capacitancesIEEE Transactions on Electron Devices, 1983
- VLSI parasitic capacitance determination by flux tubesIEEE Circuits & Systems Magazine, 1982
- Multi-dimensional simulation of VLSI wiring capacitancePublished by Institute of Electrical and Electronics Engineers (IEEE) ,1982
- Coupling capacitances for two-dimensional wiresIEEE Electron Device Letters, 1981
- Capacitances of a planar multiconductor configuration on a dielectric substrate by a mixed order finite-element methodIEEE Transactions on Circuits and Systems, 1976
- Calculation of the capacitance coefficients of planar conductors on a dielectric surfaceIEEE Transactions on Circuit Theory, 1973
- Capacitance of Parallel Rectangular Plates Separated by a Dielectric SheetIEEE Transactions on Microwave Theory and Techniques, 1972
- TEM wave properties of microstrip transmission linesProceedings of the Institution of Electrical Engineers, 1968