A multichip package for high-speed logic die
- 2 January 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Electrical analysis of a thin film multichip module substratePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Via processing options for MCM-D fabrication: excimer laser ablation vs. reactive ion etchingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Design of a High Performance DIP-Like Pin Array Package for Logic DevicesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983