Microactuated self-assembling of 3D polysilicon structures with reshaping technology
- 22 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 268 (10846999) , 477-481
- https://doi.org/10.1109/memsys.1997.581906
Abstract
This abstract proposes and experimentally confirms the automatic self-assembling of 3D polysilicon structures, compatible with both mass production and IC based surface machining. This technique combines an integrated actuation based on the scratch drive actuator (SDA), for the structure raising up, and the reshaping technology to obtain the permanent 3D shapes. Complex 3D structures have been successfully realised and their electrostatic actuation have been obtained. This self-building capability of 3D devices from silicon surface micromachining opens new integration capabilities and new application field for MEMS.Keywords
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