Moisture absorption and mechanical performance of surface mountable plastic packages

Publisher Website

6 January 2003

proceedings article
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. 49-58
https://doi.org/10.1109/ecc.1988.12569

Abstract

No abstract available

Keywords

This publication has 2 references indexed in Scilit:

Investigations of Large PLCC Package Cracking During Surface Mount Exposure
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
Moisture Resistance Degradation of Plastic LSIs by Reflow Soldering
Published by Institute of Electrical and Electronics Engineers (IEEE) ,1985