Flip-chip bonding with solder dipping
- 1 July 1985
- journal article
- letter
- Published by AIP Publishing in Review of Scientific Instruments
- Vol. 56 (7) , 1459-1460
- https://doi.org/10.1063/1.1138505
Abstract
We report a simple technique for making flip‐chip contacts. The equipment required, in addition to a small‐scale photoresist clean room, is a beaker of molten solder.Keywords
This publication has 2 references indexed in Scilit:
- Coplanar flip-chip mounting technique for picosecond devicesReview of Scientific Instruments, 1984
- Capillary bonded components for injection laser transmitter modulesElectronics Letters, 1982