TiSi2/TiN–A Stable Multilayered Contact Structure for Shallow Implanted Junctions in VLSI Technology
- 1 December 1983
- journal article
- Published by IOP Publishing in Physica Scripta
- Vol. 28 (6) , 633-636
- https://doi.org/10.1088/0031-8949/28/6/008
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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- Diffusion barriers in thin filmsThin Solid Films, 1978
- Diffusion in the titanium-aluminium system—I. Interdiffusion between solid Al and Ti or Ti-Al alloysActa Metallurgica, 1973
- The structure of (Ti,Re)Si2Acta Crystallographica, 1964