Process optimization and characterization of silicon microneedles fabricated by wet etch technology
- 6 June 2005
- journal article
- Published by Elsevier in Microelectronics Journal
- Vol. 36 (7) , 650-656
- https://doi.org/10.1016/j.mejo.2005.04.044
Abstract
No abstract availableKeywords
This publication has 11 references indexed in Scilit:
- Microsystems for Drug and Gene DeliveryProceedings of the IEEE, 2004
- Geometrical effects in mechanical characterizing of microneedle for biomedical applicationsSensors and Actuators B: Chemical, 2004
- Insertion of microneedles into skin: measurement and prediction of insertion force and needle fracture forceJournal of Biomechanics, 2004
- Silicon micromachined hollow microneedles for transdermal liquid transportJournal of Microelectromechanical Systems, 2003
- Side-opened out-of-plane microneedles for microfluidic transdermal liquid transferJournal of Microelectromechanical Systems, 2003
- Microfabricated Microneedles: A Novel Approach to Transdermal Drug DeliveryJournal of Pharmaceutical Sciences, 1998
- Compensating corner undercutting in anisotropic etching of (100) silicon for chip separationJournal of Micromechanics and Microengineering, 1995
- Determination of rates for orientation-dependent etchingSensors and Actuators A: Physical, 1995
- Morphology of etch hillock defects created during anisotropic etching of siliconJournal of Micromechanics and Microengineering, 1994
- An ion milling pattern transfer technique for fabrication of three-dimensional micromechanical structuresJournal of Microelectromechanical Systems, 1993