Mechanical properties and microstructural characterization of Al-0.5%Cu thin films
- 1 November 1990
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 19 (11) , 1231-1237
- https://doi.org/10.1007/bf02673337
Abstract
No abstract availableKeywords
This publication has 11 references indexed in Scilit:
- High-spatial-resolution x-ray microanalysis of Al-2wt.% Cu aluminum thin filmsProceedings, annual meeting, Electron Microscopy Society of America, 1989
- A new x-ray diffractometer design for thin-film texture, strain, and phase characterizationJournal of Vacuum Science & Technology B, 1988
- The Stability of a Dislocation Threading a Strained Layer on a SubstrateJournal of Applied Mechanics, 1987
- Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal historyIEEE Transactions on Electron Devices, 1987
- Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniquesJournal of Materials Research, 1986
- Hall-petch relation in thin film metallizationsScripta Metallurgica, 1986
- Low temperature strain behavior of Pb thin films on a substrateMetallurgical Transactions A, 1982
- Reactive ion etching induced corrosion of Al and Al-Cu filmsJournal of Applied Physics, 1981
- Thermal strain in lead thin films VI: Effects of oxygen dopingThin Solid Films, 1980
- Grain Growth and Stress Relief in Thin FilmsJournal of Vacuum Science and Technology, 1972