Effects of Cu, Ag and Sb on the creep-rupture strength of lead-free solder alloys
- 1 September 2001
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 30 (9) , 1228-1231
- https://doi.org/10.1007/s11664-001-0154-4
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Effect of microalloying on the creep strength and microstructure of an eutectic Sn-Pb solder alloyJournal of Electronic Materials, 1999
- Tensile, creep, and ABI tests on sn5%sb solder for mechanical property evaluationJournal of Electronic Materials, 1997
- Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A reviewJournal of Electronic Materials, 1994