Recent developments in deep x-ray lithography
- 1 November 1998
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
- Vol. 16 (6) , 3526-3534
- https://doi.org/10.1116/1.590490
Abstract
No abstract availableKeywords
This publication has 20 references indexed in Scilit:
- Multi-level exposures and 3-D X-ray patterning for high-aspect ratio microstructuresMicroelectronic Engineering, 1998
- Calculation and experimental determination of the structure transfer accuracy in deep x-ray lithographyJournal of Micromechanics and Microengineering, 1997
- Simulational studies of energy deposition and secondary processes in deep x-ray lithographyJournal of Micromechanics and Microengineering, 1997
- X-ray microfabrication of multi-level structures and 3-D patterningMicroelectronic Engineering, 1997
- Investigation of the adhesive strength of PMMA structures on substrates obtained by deep X-ray lithographyMicroelectronic Engineering, 1996
- Thermoelastic deformations of masks for deep X-ray lithographyMicroelectronic Engineering, 1995
- Parametric modeling at resist–substrate interfacesJournal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 1994
- Photonic band structure: The face-centered-cubic case employing nonspherical atomsPhysical Review Letters, 1991
- Thermoelastic effects in x-ray lithography masks during synchrotron storage ring irradiationMicroelectronic Engineering, 1990
- Computer simulations of resist profiles in x-ray lithographyJournal of Vacuum Science and Technology, 1981