Adhesion and acoustic emission analysis of failures in nitride films with a metal interlayer
- 31 December 1997
- journal article
- Published by Elsevier in Acta Materialia
- Vol. 45 (12) , 5163-5175
- https://doi.org/10.1016/s1359-6454(97)00180-8
Abstract
No abstract availableKeywords
This publication has 14 references indexed in Scilit:
- Microwedge indentation of the thin film fine line—I. MechanicsActa Materialia, 1996
- Toughness of an interface along a thin ductile layer joining elastic solidsPhilosophical Magazine A, 1994
- Acoustic emission analysis of stable and unstable fracture in high strength aluminium alloysEngineering Fracture Mechanics, 1992
- An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experimentsJournal of Materials Research, 1992
- Growth and configurational stability of circular, buckling-driven film delaminationsActa Metallurgica et Materialia, 1992
- The fracture resistance of a model metal/ceramic interfaceActa Metallurgica et Materialia, 1991
- Microscratch and load relaxation tests for ultra-thin filmsJournal of Materials Research, 1991
- Mixed Mode Cracking in Layered MaterialsPublished by Elsevier ,1991
- On the mechanics of delamination and spalling in compressed filmsInternational Journal of Solids and Structures, 1984
- Problems Involving a Receding Contact Between a Layer and a Half SpaceJournal of Applied Mechanics, 1972