High Density Multilayer Substrate For Si On Si High Speed Module
- 24 August 2005
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 353-357
- https://doi.org/10.1109/iemt.1992.639919
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Electrical analysis of a thin film multichip module substratePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Packaging Technology for the NEC SX SupercomputerIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1985