Morphology of Void-Hillock Formation at Transverse Scratches in Aluminum Thin Film
- 1 June 1971
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 42 (7) , 2996-2998
- https://doi.org/10.1063/1.1660661
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
- Electromigration Damage in Aluminum Film ConductorsJournal of Applied Physics, 1970
- The effects of dielectric overcoating on electromigration in aluminum interconnectionsIEEE Transactions on Electron Devices, 1969
- Electromigration—A brief survey and some recent resultsIEEE Transactions on Electron Devices, 1969
- Electromigration in Thin Al FilmsJournal of Applied Physics, 1969
- Infrared Techniques for Measuring Temperature and Related Phenomena of MicrocircuitsApplied Optics, 1968
- RESISTANCE MONITORING AND EFFECTS OF NONADHESION DURING ELECTROMIGRATION IN ALUMINUM FILMSApplied Physics Letters, 1968
- DIRECT TRANSMISSION ELECTRON MICROSCOPE OBSERVATION OF ELECTROTRANSPORT IN ALUMINUM THIN FILMSApplied Physics Letters, 1967
- A NEW METHOD FOR POINT TUNNELING INTO SUPERCONDUCTORSApplied Physics Letters, 1967
- Concentration de défauts au voisinage des interfaces dans un métal soumis à des gradients de potentiel électrique ou de températurePhysica Status Solidi (b), 1966