Microstructural engineering of solders
- 1 November 1999
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 28 (11) , 1176-1183
- https://doi.org/10.1007/s11664-999-0154-3
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Enhanced solder alloy performance by magnetic dispersionsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1994
- A viable tin-lead solder substitute: Sn-Ag-CuJournal of Electronic Materials, 1994