Shear deformation in Sn-3.5Ag and Sn-3.6Ag-1.0Cu solder joints subjected to asymmetric four-point bend tests
- 1 September 2001
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 30 (9) , 1214-1221
- https://doi.org/10.1007/s11664-001-0152-6
Abstract
No abstract availableKeywords
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