Analysis of ring and plug shear strengths for comparison of lead-free solders
- 1 October 2000
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 29 (10) , 1258-1263
- https://doi.org/10.1007/s11664-000-0021-8
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Properties of ternary Sn-Ag-Bi solder alloys: Part II—Wettability and mechanical properties analysesJournal of Electronic Materials, 1999
- Developing lead-free solders: A challenge and opportunityJOM, 1993