Behavior of delaminated plastic IC packages subjected to encapsulation cooling, moisture absorption, and wave soldering
- 1 January 1995
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 18 (3) , 634-645
- https://doi.org/10.1109/95.465163
Abstract
No abstract availableThis publication has 14 references indexed in Scilit:
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