Abstract
Ni/V and Ni/Ti multilayers with 3–10 nm layer periods and 8 or 32 layer pairs were deposited with rf sputtering, and examined by X-ray diffraction and transmission electron microscopy(TEM). The increase of X-ray diffraction peak numbers proved that the sharper interfaces were formed under lower Ar pressure, and the estimated interfacial roughness for multilayers deposited at 2.1 Pa was 0.55 nm. The microcrystalline structure was observed by TEM in the Ni layer, and seemed to dominate the residual interfacial roughness.