The design of new, Pb-free solder alloys with improved properties
- 19 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 171-176
- https://doi.org/10.1109/isee.1995.514970
Abstract
The goal of the research presented in this paper is to identify Pb-free alloys with melting temperatures close to or lower than that of the near-eutectic 40Pb-60Sn solder (melting point of 183/spl deg/C), and that with the best mechanical properties. We have obtained substantially improved mechanical properties through manipulation of alloy microstructures. The following three alloys with superior mechanical properties are discussed: i) Sn-3.5%Ag-1%Zn-0.5%Cu with a melting point of /spl sim/216/spl deg/C, ii) Sn-8%Zn-5%In-(0.1-0.5%)Ag with a melting point of /spl sim/187/spl deg/C, and iii) 54.5%Bi-45%Sn-0.5%Ag with a melting point of /spl sim/140/spl deg/C.Keywords
This publication has 4 references indexed in Scilit:
- New lead-free, Sn-Ag-Zn-Cu solder alloy with improved mechanical propertiesApplied Physics Letters, 1994
- New Pb-free solder alloy with superior mechanical propertiesApplied Physics Letters, 1993
- Fatigue Lives on 60Sn/40Pb Solder Joints Made With Different Cooling RatesJournal of Electronic Packaging, 1992
- The Role of Microstructure in Thermal Fatigue of Pb-Sn Solder JointsPublished by Springer Nature ,1991