Packaging for a 1 Gb/s OEIC fiber-optic data link
- 13 January 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
The package for a 1-Gb/s optoelectronic integrated circuit (OEIC) fiber-optic data link is described. The link utilizes a four-channel AlGaAs laser diode array operating at 0.85- mu m wavelength, multimode optical fibers, and two GaAs OEICs, which include photodetectors, amplifiers, laser drivers, and clock recovery and serializer/deserializer circuitry. The approach described meets a majority of the functional requirements for packaging OEICs and optical fibers. It provides high-speed electrical interconnects for gigabit/second data rates, thermal management, and accurate alignment for optical fibers. However, it does not address issues relating to reliability and manufacturability. Although optoelectronic packaging is similar to conventional IC packaging, it is noted that further developments in manufacturing and reliability of the optical portions of the package will be necessary to bring optical interconnects into more widespread use in computer mainframe applications.Keywords
This publication has 7 references indexed in Scilit:
- Optical Fiber Coupling Approaches For Multi-Channel Laser And Detector ArraysPublished by SPIE-Intl Soc Optical Eng ,1989
- A GaAs MESFET IC for optical multiprocessor networksIEEE Transactions on Electron Devices, 1989
- Fully integrated 1-Gbit/s GaAs MESFET fiber-optic receiver chipPublished by Optica Publishing Group ,1988
- InGaAsP/InP long wavelength optoelectronic integrated circuits (OEIC's) for high-speed optical fiber communication systemsJournal of Lightwave Technology, 1987
- High-power ridge-waveguide AlGaAs GRIN-SCH laser diodeElectronics Letters, 1986
- Recent progress in optoelectric integrated circuits (OEIC's)IEEE Journal of Quantum Electronics, 1986
- The Thin-Film Module as a High-Performance Semiconductor PackageIBM Journal of Research and Development, 1982