SMT-compatible optical-I/O chip packaging for chip-level optical interconnects
- 13 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 870-875
- https://doi.org/10.1109/ectc.2001.927895
Abstract
The rapid increase in Internet data traffic requires large-scale switching systems that have high-bandwidth and high-density board-to-board, board-to-backplane and chip-to-chip interconnections within the system. This paper describes one solution for implementing an economical chip-to-chip optical interconnection. The basic concept is as follows; 1) Silicon ASICs are hybrid integrated with GaAs optoelectronic devices by bump bonding, 2) optoelectronic packages are surface-mounted on a printed circuit board (PCB), 3) optical paths for connecting chips are implemented as an interlayer of the PCB, and 4) a wide and collimated optical beam couples the chip and the board through a narrow air gap. Since it can replace high speed electronic wiring by optical at the chip-level and also there are no optical fibers or connectors on the board, this optical-I/O chip packaging has the potential to bring revolutionary change in optoelectronic packaging.Keywords
This publication has 11 references indexed in Scilit:
- Packaging for a 40-channel parallel optical interconnection module with an over 25-Gb/s throughputPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Parallel optical link (PAROLI) for multichannel gigabit rate interconnectionsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Two-dimensional optical interconnect between CMOS IC'sPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- System level packaging of high density optoelectronic interconnectionsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Hybrid integration of polymer microlens with VCSEL using drop-on-demand techniquePublished by SPIE-Intl Soc Optical Eng ,2000
- Ink-Jet Fabrication of Polymer Microlens for Optical-I/O Chip PackagingJapanese Journal of Applied Physics, 2000
- New technology for electrical/optical systems on module and board level: the EOCB approachPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2000
- Polymeric optical waveguide films with 45°mirrors formed with a 90° V-shaped diamond bladeElectronics Letters, 1997
- Very low loss multimode polymeric optical waveguidesElectronics Letters, 1997
- Advanced optical interconnection technology in switching equipmentJournal of Lightwave Technology, 1995