A methodology for drop performance prediction and application for design optimization of chip scale packages
- 28 July 2005
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 2, 472-479
- https://doi.org/10.1109/ectc.2005.1441308
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
- Drop impact survey of portable electronic productsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2004
- Modeling technique for reliability assessment of portable electronic product subjected to drop impact loadsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2004
- Drop impact test - mechanics & physics of failurePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Transition to Pb-free manufacturing using land grid array packaging technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Investigating the drop impact of portable electronic productsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003