A heat resistant PIQ, polymer-based interconnection using a multilevel lift-off pillar fabrication
- 1 January 1989
- journal article
- Published by Wiley in Makromolekulare Chemie. Macromolecular Symposia
- Vol. 24 (1) , 349-357
- https://doi.org/10.1002/masy.19890240135
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
- Advantages of using Spin-On-Glass layer in interconnection dielectric planarizationMicroelectronic Engineering, 1986
- Two layer planarization processMicroelectronic Engineering, 1985
- Author Newsletters and Journals: Supplement 2Serials Review, 1984
- A Method of Forming Contacts Between Two Conducting Layers Separated by a DielectricJournal of the Electrochemical Society, 1984
- Planarization Properties of Resist and Polyimide CoatingsJournal of the Electrochemical Society, 1983
- Process for Forming Passivated Metal Interconnection System with a Planar SurfaceJournal of the Electrochemical Society, 1983
- Polyimide insulators for multilevel interconnectionsThin Solid Films, 1981