High performance microsystem packaging: A perspective
- 1 October 1997
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 37 (10-11) , 1771-1781
- https://doi.org/10.1016/s0026-2714(97)00158-3
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Material and processing issues for the monolithic integration of microelectronics with surface-micromachined polysilicon sensors and actuatorsPublished by SPIE-Intl Soc Optical Eng ,1995