Terminal and Cooling Requirements for LSI Packages
- 1 June 1981
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 4 (2) , 187-191
- https://doi.org/10.1109/tchmt.1981.1135800
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- On the Tradeoff Between Logic Performance and Circuit-to-Pin Ratio for LSIIEEE Transactions on Computers, 1972
- On a Pin Versus Block Relationship For Partitions of Logic GraphsIEEE Transactions on Computers, 1971