Materials behaviour and the reliability in performance of solder joints

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Abstract
While the implementation of lead‐free solder technology has been the focus of much recent research, the challenge of joint structural integrity should not be overlooked. The paper summarises the significant variability in the mechanical properties of solders, both in terms of the prevailing testing conditions and between the alloys themselves. Using conventional routes to life prediction for an elementary creep situation, it demonstrates the critical importance of understanding the failure processes and utilising materials data that are appropriate.
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