Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connections
- 1 July 2001
- journal article
- Published by IOP Publishing in Journal of Micromechanics and Microengineering
- Vol. 11 (4) , 382-385
- https://doi.org/10.1088/0960-1317/11/4/317
Abstract
Local anodic bonding of a common Kovar alloy to Pyrex is presented. This technique is ideally suitable for temperature-, solvent- and pressure-resistant microfluidic connections. In this paper we mainly concentrate on the stress problems occurring during and after bonding. Because of the different thermal expansion coefficients of Kovar and Pyrex a structure is added in order to release the thermal stresses induced during bonding. Optimum bonding conditions in vacuum on Pyrex and on a Pyrex-Si bonded wafer pair are investigated. In the latter case bonding for 3 h at 250 °C and 1.5 kV results in a high-quality bond.Keywords
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