Optimal self-damped lossy transmission line interconnections for multichip modules
- 1 January 1992
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Circuits and Systems II: Analog and Digital Signal Processing
- Vol. 39 (11) , 765-771
- https://doi.org/10.1109/82.204124
Abstract
No abstract availableKeywords
This publication has 9 references indexed in Scilit:
- New fast and accurate line parameter calculation of general multiconductor transmission lines in multilayered mediaIEEE Transactions on Microwave Theory and Techniques, 1991
- Interconnection Processes and MaterialsAT&T Technical Journal, 1990
- Multichip modules: next-generation packagesIEEE Spectrum, 1990
- On the Solution of a Microstripline with Two DielectricsIEEE Transactions on Microwave Theory and Techniques, 1984
- The Thin-Film Module as a High-Performance Semiconductor PackageIBM Journal of Research and Development, 1982
- Erratum to "Approximate Formulas for Line Capacitance and Characteristic Impedance of Microstrip Line"IEEE Transactions on Microwave Theory and Techniques, 1981
- Transmission-Line Properties of a Strip Line Between Parallel PlanesIEEE Transactions on Microwave Theory and Techniques, 1978
- Transmission-Line Properties of a Strip on a Dielectric Sheet on a PlaneIEEE Transactions on Microwave Theory and Techniques, 1977
- Microstrip Lines for Microwave Integrated CircuitsBell System Technical Journal, 1969